Sources: Intel and Italy are close to clinching a deal initially worth $5B to build an advanced semiconductor packaging and assembly plant in the country (Reuters) https://ift.tt/xGdibJP
Reuters:
Sources: Intel and Italy are close to clinching a deal initially worth $5B to build an advanced semiconductor packaging and assembly plant in the country — Italy is close to clinching a deal initially worth $5 billion with Intel (INTC.O) to build an advanced semiconductor packaging …
Comments
Post a Comment